Edgewater Wireless Systems Inc. (TSXV: YFI) (OTC: KPIFF), a pioneer in AI-powered Wi-Fi Spectrum Slicing silicon solutions, announced that a presentation by President and CEO Andrew Skafel at a Silicon Catalyst event in Sunnyvale, California, is now available on the company's website. The presentation outlines Edgewater's patented Spectrum Slicing technology, PrismIQ platform strategy, and roadmap for high-reliability wireless connectivity.
The presentation comes as Edgewater transitions from investor validation to disciplined semiconductor execution. Following a strategic investor-led first close and initiation of detailed architecture and design reviews for key elements of its Spectrum Slicing and PrismIQ roadmap, the company is increasing visibility around its next-generation Wi-Fi strategy. The growing market need for more predictable, resilient wireless performance is driving this focus.
Edgewater's Spectrum Slicing technology enables multiple concurrent channels within a Wi-Fi band, addressing congestion, interference, and performance challenges in dense wireless environments. The company believes this approach is increasingly relevant as AI, autonomy, industrial systems, defense, public safety, and mission-critical edge applications demand reliable wireless links.
"Wi-Fi has historically been measured by peak speed," said Skafel. "The next shift is about reliability. As more critical systems depend on wireless connectivity, the market needs performance that holds up outside the lab - in complex, congested and interference-heavy environments."
Edgewater's participation in Silicon Catalyst, along with recent visibility at forums like Synopsys SNUG Silicon Valley and Microelectronics US, reflects its broader engagement across the semiconductor ecosystem. The full presentation and accompanying materials are available at Edgewater's website.
In a related update, Edgewater is proceeding with a second tranche of its non-brokered private placement of up to 16,666,667 units at $0.06 per unit for gross proceeds of up to $1,000,000, with a permitted 15% over-allotment of up to 2,500,000 units. Each unit consists of one common share and one common share purchase warrant exercisable at $0.09 per share for two years. The TSX Venture Exchange has granted a 30-day extension to complete the offering. Net proceeds are expected to support semiconductor design, engineering, and product development for the Spectrum Slicing prototype and general working capital.
The company closed an initial tranche on June 29, 2026, issuing 7,155,879 units for gross proceeds of $429,353. Securities issued under the offering are subject to a four-month hold period. Completion of the second tranche remains subject to TSXV acceptance. Additional information is available in the company's news releases dated June 1 and June 29, 2026.
